Pb-Sn和Cu-Ag-Sn无pb电子接头中三元金属间合金的形成动力学

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI:10.1109/ECTC.2001.927807

A. Zribi, L. Zavalij, P. Borgesen, A. Primavera, G. Westby, E. Cotts

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引用次数: 14

摘要

通过数值模拟研究了在Pb-Sn焊料/Ni互连中Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/形成的简单模型。先前的实验观察表明，回流后Pb-Sn焊料与Ni之间的界面由Ni/sub 3/Sn/sub 4/ alloy组成，Au分布在PbSn焊料球中。在150℃退火过程中，观察到在Pb-Sn焊料/Ni/sub 3/Sn/sub 4/界面处形成Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/。采用数值模拟方法计算了Au在界面上的最大通量，并假设Au立即加入到Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/中，计算了Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/的最大生成速率。这一速率与两个不同研究中测量到的Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/的形成速率相似。在这些观察的背景下，讨论了Sn-Ag-Cu/Ni焊料互连中(CuNi)6SnS的形成。

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The kinetics of formation of ternary intermetallic alloys in Pb-Sn and Cu-Ag-Sn Pb-free electronic joints

A simple model of the formation of Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/ in Pb-Sn solder/Ni interconnects is examined by numerical simulation. Previous experimental observation has shown that after reflow the interface consists of the Ni/sub 3/Sn/sub 4/ alloy between Pb-Sn solder and Ni, with Au distributed through the PbSn solder ball. Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/ was observed to form at the Pb-Sn solder/Ni/sub 3/Sn/sub 4/ interface during annealing at 150/spl deg/C in a number of studies. The numerical simulation was used to calculate the maximum flux of Au to the interface, and with the assumption that this Au was immediately incorporated in to Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/ a maximum rate of formation of Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/ was calculated. This rate was found to be similar to measured rates of formation of Au/sub 0.1/Ni/sub 0.1/Sn/sub 0.8/ from two different studies. The formation of(CuNi)6SnS in Sn-Ag-Cu/Ni solder interconnects was discussed within the context of these observations.

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来源期刊

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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