低银含量微合金SAC焊料锡晶须生长

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887583

B. Illés, Barbara Horváth

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引用次数: 2

摘要

本文研究了无铅SAC (SnAgCu)钎料合金的锡晶须生长特性。研究了两种微合金SAC (SnAgCu+Bi+Sb)和广泛应用的SAC305作为参考。FR4测试板是针对18片0805片式电阻元件研制的。采用imm-Sn表面处理工艺制备焊点。在高温和不同湿度条件下对样品进行时效处理，以诱导锡晶须的形成。采用了85°C/85RH%、105°C/100RH%和105°C/20RH%三种老化条件。测试时间为3000小时。每隔500小时用扫描电镜检查晶须生长情况。结果表明，无铅SAC钎料合金也能产生锡晶须，晶须的形成能力取决于SAC钎料的成分。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Tin whisker growth from low Ag content micro-alloyed SAC solders

In this paper the tin whisker growth properties of lead-free SAC (SnAgCu) solder alloys were investigated. There different alloys were studied: two micro-alloyed SAC (SnAgCu+Bi+Sb) and the widely applied SAC305 as reference. FR4 test board was developed for 18 pieces of 0805 chip resistor components. Solder joints were fabricated on imm-Sn surface finish. The samples were aged in elevated temperatures and different humidity levels to induce the tin whisker formation. Three kinds of aging conditions have been used: 85°C/85RH%, 105°C/100RH% and 105°C/20RH%. The test duration was 3000 hours. Whisker growth was checked after every 500 hours by scanning electron microscope. It was shown that the lead-free SAC solder alloys can also develop tin whiskers and the whiskering ability depends on the composition of the SAC solders.

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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