{"title":"MXM图形模块的加固","authors":"I. Straznicky","doi":"10.1109/HPEC.2012.6408666","DOIUrl":null,"url":null,"abstract":"MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.","PeriodicalId":193020,"journal":{"name":"2012 IEEE Conference on High Performance Extreme Computing","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Ruggedization of MXM graphics modules\",\"authors\":\"I. Straznicky\",\"doi\":\"10.1109/HPEC.2012.6408666\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.\",\"PeriodicalId\":193020,\"journal\":{\"name\":\"2012 IEEE Conference on High Performance Extreme Computing\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 IEEE Conference on High Performance Extreme Computing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HPEC.2012.6408666\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE Conference on High Performance Extreme Computing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HPEC.2012.6408666","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
MXM modules, used to package graphics processing devices for use in benign environments, have been tested for use in harsh environments typical of deployed defense and aerospace systems. Results show that specially mechanically designed MXM GP-GPU modules can survive these environments, and successfully provide the enormous processing capability offered by the latest generation of GPUs to harsh environment applications.
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