{"title":"用于高集成77 GHz汽车雷达传感器的封装技术","authors":"M. Mayer, K. Baur, T. Walter","doi":"10.23919/eumc.2009.5296534","DOIUrl":null,"url":null,"abstract":"The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.","PeriodicalId":232128,"journal":{"name":"2009 European Microwave Conference (EuMC)","volume":"200 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Packaging technologies for highly integrated 77 GHz automotive radar sensors\",\"authors\":\"M. Mayer, K. Baur, T. Walter\",\"doi\":\"10.23919/eumc.2009.5296534\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.\",\"PeriodicalId\":232128,\"journal\":{\"name\":\"2009 European Microwave Conference (EuMC)\",\"volume\":\"200 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 European Microwave Conference (EuMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/eumc.2009.5296534\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 European Microwave Conference (EuMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/eumc.2009.5296534","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Packaging technologies for highly integrated 77 GHz automotive radar sensors
The availability of SiGe with transit frequencies exceeding 200 GHz enables highly integrated and cost effective 77 GHz radar sensors for automotive applications. A major challenge for future radar generations is the development of an appropriate packaging technology. We propose a system in package approach (SIP) utilizing a SMD package without external 77 GHz connections. Beamforming is possible with dielectric lenses permitting the use of this modular concept in different automotive applications.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
