增强电导率调制的高压igbt的比较研究

K. Padmanabhan, P. Shea, Z. Shen
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引用次数: 0

摘要

对一种增强绝缘栅双极晶体管(IGBT)电导率调制的新型器件结构进行了数值研究。在传统的IGBT结构中增加了n型空穴阻挡层和深P+塞发射极结。观察到,单独增加P+插头可以降低开关功率损耗,VCE(sat)没有变化,但雪崩击穿电压(BV)和器件的短路坚固性得到改善。当P+插头与N孔阻挡层结合使用时,VCE(sat)进一步提高了0.4 V。这是在没有通常与其他N孔屏障结构相关的BV和坚固性退化的情况下完成的。利用二维TCAD仿真对新型IGBT结构的设计空间进行了全面表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative study of high voltage IGBTs with enhanced conductivity modulation
A new device structure for enhancing conductivity modulation in the Insulated Gate Bipolar Transistor (IGBT) is numerically studied. An N-type hole barrier layer and a deep P+ plug emitter tie are added to the conventional IGBT structure. It is observed that the addition of the P+ plug alone results in a reduction in switching power losses and no change in VCE(sat), however the avalanche breakdown voltage (BV) and short circuit ruggedness of the device are improved. A further 0.4 V improvement in VCE(sat) is observed when the P+ plug is implemented in conjunction with an N hole barrier. This is accomplished without the usual degradation of BV and ruggedness normally associated with other N hole barrier structures. The design space of the new IGBT structure is thoroughly characterized using 2-D TCAD simulation.
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