{"title":"增强电导率调制的高压igbt的比较研究","authors":"K. Padmanabhan, P. Shea, Z. Shen","doi":"10.1109/SECON.2012.6196955","DOIUrl":null,"url":null,"abstract":"A new device structure for enhancing conductivity modulation in the Insulated Gate Bipolar Transistor (IGBT) is numerically studied. An N-type hole barrier layer and a deep P+ plug emitter tie are added to the conventional IGBT structure. It is observed that the addition of the P+ plug alone results in a reduction in switching power losses and no change in VCE(sat), however the avalanche breakdown voltage (BV) and short circuit ruggedness of the device are improved. A further 0.4 V improvement in VCE(sat) is observed when the P+ plug is implemented in conjunction with an N hole barrier. This is accomplished without the usual degradation of BV and ruggedness normally associated with other N hole barrier structures. The design space of the new IGBT structure is thoroughly characterized using 2-D TCAD simulation.","PeriodicalId":187091,"journal":{"name":"2012 Proceedings of IEEE Southeastcon","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Comparative study of high voltage IGBTs with enhanced conductivity modulation\",\"authors\":\"K. Padmanabhan, P. Shea, Z. Shen\",\"doi\":\"10.1109/SECON.2012.6196955\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new device structure for enhancing conductivity modulation in the Insulated Gate Bipolar Transistor (IGBT) is numerically studied. An N-type hole barrier layer and a deep P+ plug emitter tie are added to the conventional IGBT structure. It is observed that the addition of the P+ plug alone results in a reduction in switching power losses and no change in VCE(sat), however the avalanche breakdown voltage (BV) and short circuit ruggedness of the device are improved. A further 0.4 V improvement in VCE(sat) is observed when the P+ plug is implemented in conjunction with an N hole barrier. This is accomplished without the usual degradation of BV and ruggedness normally associated with other N hole barrier structures. The design space of the new IGBT structure is thoroughly characterized using 2-D TCAD simulation.\",\"PeriodicalId\":187091,\"journal\":{\"name\":\"2012 Proceedings of IEEE Southeastcon\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 Proceedings of IEEE Southeastcon\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SECON.2012.6196955\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Proceedings of IEEE Southeastcon","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SECON.2012.6196955","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Comparative study of high voltage IGBTs with enhanced conductivity modulation
A new device structure for enhancing conductivity modulation in the Insulated Gate Bipolar Transistor (IGBT) is numerically studied. An N-type hole barrier layer and a deep P+ plug emitter tie are added to the conventional IGBT structure. It is observed that the addition of the P+ plug alone results in a reduction in switching power losses and no change in VCE(sat), however the avalanche breakdown voltage (BV) and short circuit ruggedness of the device are improved. A further 0.4 V improvement in VCE(sat) is observed when the P+ plug is implemented in conjunction with an N hole barrier. This is accomplished without the usual degradation of BV and ruggedness normally associated with other N hole barrier structures. The design space of the new IGBT structure is thoroughly characterized using 2-D TCAD simulation.