层间材料对扩散钎焊IC10高温合金扩散性能和显微组织的影响

2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME) Pub Date : 2020-05-01 DOI:10.1109/ICEDME50972.2020.00120

Qi Li, Ming Xiong, Fengmei Liu, X. Yue, Likun Li, Haitao Gao, Y. Yi

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引用次数: 0

摘要

采用俄罗斯焊料M4层间粉对IC10高温合金进行了扩散钎焊试验。通过不同温度下的润湿接触角来评价高温合金的润湿质量。结果表明:在1250℃温度下，层间粉末M4合金的接触角不超过10°，在IC10合金表面具有较高的润湿性和铺展性。使用层间粉末M4时，接头的组织从母材到焊点的过渡平滑。在接头组织中，母材含有大量的Ɣ′相。使用层间粉末M4时，焊缝金属的显微组织不存在连续的共晶层，而是包含碳化物和其他相。

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Effect of interlayer material on the spreading performance and microstructure of diffusion brazd IC10 superalloy

The diffusion brazd test of IC10 superalloy was carried out by using Russia solder M4 interlayer powder. The wetting quality of the high-temperature alloy was evaluated by the contact angle of wetting at various temperatures. The result shows that at the temperature of 1250°C, the contact angles of interlayer powder M4 alloy do not exceed 10°, it has high wettability and spreadability over the surface of the IC10 alloy. The structure of the joints has a smooth transition from the base metal to the soldered joint when the interlayer powder M4 was used. In the structure of the joint, the base metal contains a large number of Ɣ '- phases. The microstructure of the weld metal does not have continuous eutectic layers, but includes carbide carboride and other phases when the interlayer powder M4 was used.

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2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME)

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