Green在3D集成电路/封装应用中损耗多层电介质中的作用

2018 IEEE International Conference on Computational Electromagnetics (ICCEM) Pub Date : 2018-03-26 DOI:10.1109/COMPEM.2018.8496730

Biyao Zhao, Siming Pan, J. Fan

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引用次数: 2

摘要

本文利用DCIM方法研究了三维集成电路/封装中损耗多层电介质中的格林函数。通过从DCIM中提取分量，分析了层状介质中的损耗效应。提出的分层格林函数可用于3D集成电路和封装应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Green's Functions in Lossy Multi-Layer Dielectrics for 3D IC/Packaging Applications

Green's function in lossy multi-layer dielectrics is presented using DCIM method for 3D IC/packaging in this paper. Loss effects in layered medium are analysed through the components extracted from DCIM. The proposed layered Green's function can be used for 3D IC and packaging applications.

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来源期刊

2018 IEEE International Conference on Computational Electromagnetics (ICCEM)

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