{"title":"用六轴亚微米测试仪测试聚合物薄膜和下填料的本构模型","authors":"Z. Qian, Minfu Lu, Jianjun Wang, Sheng Liu","doi":"10.1115/imece1997-1234","DOIUrl":null,"url":null,"abstract":"\n The thermo-mechanical testing of Polycarbonate, Kapton, and Nylon films and underfill HYSOL FP4526 is reported, including the details of specimens, test procedures, and the 6-axis mini tester. The constitutive framework proposed for polymer films is, for the first time, applied to model the thermo-mechanical properties of underfill HYSOL FP4526 in this paper.","PeriodicalId":230568,"journal":{"name":"Applications of Experimental Mechanics to Electronic Packaging","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester\",\"authors\":\"Z. Qian, Minfu Lu, Jianjun Wang, Sheng Liu\",\"doi\":\"10.1115/imece1997-1234\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n The thermo-mechanical testing of Polycarbonate, Kapton, and Nylon films and underfill HYSOL FP4526 is reported, including the details of specimens, test procedures, and the 6-axis mini tester. The constitutive framework proposed for polymer films is, for the first time, applied to model the thermo-mechanical properties of underfill HYSOL FP4526 in this paper.\",\"PeriodicalId\":230568,\"journal\":{\"name\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applications of Experimental Mechanics to Electronic Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece1997-1234\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Experimental Mechanics to Electronic Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece1997-1234","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Testing and Constitutive Modeling of Thin Polymer Films and Underfills by a 6-Axis Submicron Tester
The thermo-mechanical testing of Polycarbonate, Kapton, and Nylon films and underfill HYSOL FP4526 is reported, including the details of specimens, test procedures, and the 6-axis mini tester. The constitutive framework proposed for polymer films is, for the first time, applied to model the thermo-mechanical properties of underfill HYSOL FP4526 in this paper.
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