迭代高精度后硅误差定位

V. Bertacco, Wade Bonkowski
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引用次数: 4

摘要

现代数字电路的日益复杂加剧了验证这些系统功能的挑战。更复杂的是,缩短上市时间的限制给在短时间内获得正确的设备带来了更大的压力。因此,当设计的第一个硅原型可用时,越来越多的验证负担已经转移到后硅阶段。这个验证阶段带来了更快的测试执行速度,但代价是诊断错误的能力非常有限。使问题进一步复杂化的是,由于正在验证的设备的物理性质,间歇性故障并不罕见。在这项工作中,我们提出了ItHELPS,这是一种在工业规模的复杂数字设计中识别bug表现的时间和负责它的根信号的解决方案。我们采用了一种基于机器学习解决方案(DBSCAN)和自适应细化分析的协同方法,能够将故障的位置缩小到少数几个信号,这些信号可能深埋在设计层次结构中。我们通过实验发现,我们的方法比先前最先进的解决方案的准确性高出两个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
ItHELPS: Iterative high-accuracy error localization in post-silicon
The increasing complexity of modern digital circuits has exacerbated the challenge of verifying the functionality of these systems. To further compound the issue, shrinking time-to-market constraints place increased pressure on attaining correct devices in short amounts of time. As a result, more and more of the burden of validation has shifted to the post-silicon stage, when the first silicon prototypes of a design become available. This validation phase brings much faster test execution speeds, at the cost of a very limited ability of diagnosing bugs. To further compound the problem, intermittent failures are not uncommon, due to the physical nature of the device under validation. In this work we propose ItHELPS, a solution to identify the timing of a bug manifestation and the root signals responsible for it in industry-size complex digital designs. We employ a synergistic approach based on a machine-learning solution (DBSCAN) paired with an adaptive refinement analysis, capable of narrowing the location of a failure down to a handful of signals, possibly buried deep within the design hierarchy. We find experimentally that our approach outperforms the accuracy of prior state-of-the-art solutions by two orders of magnitude.
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