rie -织构硅太阳能电池的发展

B. Damiani, R. Ludemann, D. Ruby, S. H. Zaidi, A. Rohatgi
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引用次数: 25

摘要

采用反应离子蚀刻(RIE)的无掩膜等离子体纹理技术可使硅太阳能电池的反射率极低,沉积前为5.4%,沉积后为3.9%。对表面复合和发射极性能进行了详细的研究,并采用DOSS工艺制备了太阳电池。测试了不同的等离子体损伤去除处理,以优化低寿命太阳能电池的效率。在mc-Si上观察到很少或没有等离子体损伤去除刻蚀的最高效率。增加的J/sub / sc/由于RIE纹理被证明优于单层增透涂层。这表明RIE织构是一种很有前途的织构技术,尤其适用于低寿命(多晶)硅。使用无毒,无腐蚀性的SF/sub 6/使该工艺具有大规模生产的吸引力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of RIE-textured silicon solar cells
A maskless plasma texturing technique using reactive ion etching (RIE) for silicon solar cells results in a very low reflectance of 5.4% before, and 3.9% after SiN deposition. A detailed study of surface recombination and emitter properties was made, then solar cells were fabricated using the DOSS solar cell process. Different plasma-damage removal treatments are tested to optimize low lifetime solar cell efficiencies. Highest efficiencies are observed for little or no plasma-damage removal etching on mc-Si. Increased J/sub sc/ due to the RIE texture proved superior to a single layer anti-reflection coating. This indicates that RIE texturing is a promising texturing technique, especially applicable on lower lifetime (multicrystalline) silicon. The use of nontoxic, noncorrosive SF/sub 6/ makes this process attractive for mass production.
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