用单能正电子束探测镁注入GaN中的空位型缺陷

A. Uedono, S. Takashima, M. Edo, K. Ueno, H. Matsuyama, H. Kudo, H. Naramoto, S. Ishibashi
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引用次数: 1

摘要

正电子湮灭是研究材料中空位型缺陷的一种非破坏性工具。可检测的缺陷是单空位到空位簇,并且没有样品温度或电导率的限制。利用这一技术,我们研究了氮化镓中镁注入引起的缺陷。注入多种能量(15-180 keV)的Mg离子,形成200 nm深、Mg浓度为4×1019 cm-3的盒子剖面。镁注入引入的空位缺陷主要是ga空位(VGa)和氮空位(VNs)之间的复合物。在1000℃以上退火后,这些缺陷开始团聚,主要缺陷种变为(VGa)2偶联VNs。空位型缺陷的深度分布与注入Mg的深度分布吻合较好,在1300℃退火后,空位型缺陷的深度分布没有明显变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vacancy-type defects in Mg-implanted GaN probed by a monoenergetic positron beam
Positron annihilation is a non-destructive tool for investigating vacancy-type defects in materials. Detectable defects are monovacancies to vacancy clusters, and there is no restriction of sample temperature or conductivity. Using this technique, we studied defects introduced by Mg-implantation in GaN. Mg ions of multiple energies (15-180 keV) were implanted to provide a 200-nm-deep box profile with Mg concentration of 4×1019 cm-3. The major defect species of vacancies introduced by Mg-implantation was a complex between Ga-vacancy (VGa) and nitrogen vacancies (VNs). After annealing above 1000°C, these defects started to agglomerate, and the major defect species became (VGa)2 coupled with VNs. The depth distribution of vacancy-type defects agreed well with that of implanted Mg, and no large change in the distribution was observed up to 1300°C annealing.
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