{"title":"齐纳二极管反向击穿电压作为同时加热和温度传感元件","authors":"R. McAfee, M. Fish, J. Gess","doi":"10.1109/iTherm54085.2022.9899600","DOIUrl":null,"url":null,"abstract":"Near-junction, low-cost, and high accuracy temperature-sensing methods are needed for electronics cooling. Electrical components, either thermal test die or active integrated circuit devices, can be used as temperature sensors provided that a temperature sensitive parameter is available and calibrated. Zener diodes lend themselves to use as static or dynamic temperature sensors when integrated into an existing package. However, the use of Zener diodes to simultaneously heat and sense has not been explored in literature. When a Zener diode with a high reverse breakdown voltage is selected the power dissipation can be fine-tuned to desired heating conditions and be concurrently used to sense temperature. A methodology for using Zener reverse breakdown to generate accurate junction heating curves is established.The reverse breakdown voltage of the diodes is used to define I-V-T surfaces for calibration. Calibration temperatures are established using a single-phase liquid cooled cold plate. Thermal calibration methods are developed based on existing JEDEC standards for electrical test methods for simple integrated circuit devices.The methodology was applied to develop phase change material heating curves and compare them to other thermal solutions. The developed methodology can be used for future applications requiring simultaneous heating and sensing.","PeriodicalId":351706,"journal":{"name":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Zener Diode Reverse Breakdown Voltage as a Simultaneous Heating and Temperature Sensing Element\",\"authors\":\"R. McAfee, M. Fish, J. Gess\",\"doi\":\"10.1109/iTherm54085.2022.9899600\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Near-junction, low-cost, and high accuracy temperature-sensing methods are needed for electronics cooling. Electrical components, either thermal test die or active integrated circuit devices, can be used as temperature sensors provided that a temperature sensitive parameter is available and calibrated. Zener diodes lend themselves to use as static or dynamic temperature sensors when integrated into an existing package. However, the use of Zener diodes to simultaneously heat and sense has not been explored in literature. When a Zener diode with a high reverse breakdown voltage is selected the power dissipation can be fine-tuned to desired heating conditions and be concurrently used to sense temperature. A methodology for using Zener reverse breakdown to generate accurate junction heating curves is established.The reverse breakdown voltage of the diodes is used to define I-V-T surfaces for calibration. Calibration temperatures are established using a single-phase liquid cooled cold plate. Thermal calibration methods are developed based on existing JEDEC standards for electrical test methods for simple integrated circuit devices.The methodology was applied to develop phase change material heating curves and compare them to other thermal solutions. The developed methodology can be used for future applications requiring simultaneous heating and sensing.\",\"PeriodicalId\":351706,\"journal\":{\"name\":\"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/iTherm54085.2022.9899600\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/iTherm54085.2022.9899600","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Zener Diode Reverse Breakdown Voltage as a Simultaneous Heating and Temperature Sensing Element
Near-junction, low-cost, and high accuracy temperature-sensing methods are needed for electronics cooling. Electrical components, either thermal test die or active integrated circuit devices, can be used as temperature sensors provided that a temperature sensitive parameter is available and calibrated. Zener diodes lend themselves to use as static or dynamic temperature sensors when integrated into an existing package. However, the use of Zener diodes to simultaneously heat and sense has not been explored in literature. When a Zener diode with a high reverse breakdown voltage is selected the power dissipation can be fine-tuned to desired heating conditions and be concurrently used to sense temperature. A methodology for using Zener reverse breakdown to generate accurate junction heating curves is established.The reverse breakdown voltage of the diodes is used to define I-V-T surfaces for calibration. Calibration temperatures are established using a single-phase liquid cooled cold plate. Thermal calibration methods are developed based on existing JEDEC standards for electrical test methods for simple integrated circuit devices.The methodology was applied to develop phase change material heating curves and compare them to other thermal solutions. The developed methodology can be used for future applications requiring simultaneous heating and sensing.