臂上抛光过程中的力和压力分析

Michael F. Benisch, O. Fähnle, R. Rascher, W. Bogner
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引用次数: 2

摘要

由普雷斯顿方程可知,在光学元件抛光过程中,除了相对速度和比常数KP外,压力p对去除率也有重要影响。本文论证了在抛光前对压力分布进行定性评价的可能性。压敏箔用作压力测量的压力表。说明了该测量方法的有效性。在使用这些箔的具体弱点和限制进行了讨论。最后提出了一种综合评价抛光垫不同部位压力的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Force and pressure analysis during overarm polishing
The Preston-equation implies, that, besides the relative speed υrel and a specific constant KP, the pressure p plays a significant role for the removal rate when polishing an optical component. This paper demonstrates a possibility for a qualitative evaluation of the pressure distribution before the polishing process. A pressure-sensitive foil is used as a gauge for pressure measurement. The effectiveness of this measuring method is explained. Specific weaknesses and limitations in the use of these foils are discussed. A method for an integrated evaluation of the pressure on different spots of the polishing pad is proposed at the end of the paper.
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