在具有正衬底偏压的nmosfet中,俄歇复合增强了热载子降解

L. Chiang, C.W. Tsai, T. Wang, U.C. Liu, M. Wang, L. Hsia
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引用次数: 6

摘要

在类似dtmos的工作模式下,热载流子降解增强。这一现象归因于俄歇复合辅助热电子过程。在nmosfet中测量的热电子栅极电流和光发射光谱提供了证据,表明应用正衬底偏压可以增加通道电子的高能尾部。与传统的热载子降解相反,俄歇增强的降解表现出正的温度依赖性,并且在低漏极偏压下更为显著。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Auger recombination enhanced hot carrier degradation in nMOSFETs with positive substrate bias
Enhanced hot carrier degradation is observed in DTMOS-like operation mode. This phenomenon is attributed to Auger recombination assisted hot electron process. Measured hot electron gate current and light emission spectrum in nMOSFETs provide evidence that the high-energy tail of channel electrons is increased by the application of a positive substrate bias. As opposed to conventional hot carrier degradation, the Auger enhanced degradation exhibits positive temperature dependence and is more significant at low drain bias.
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