Low cost smart labels assembled by anisotropically conductive adhesive

The most urgent issue on the way of popularizing the smart labels is cutting their cost. Various ways have been explored to approach this goal, but the cost of a smart label is still hanging around decades of cents. Attaching a RFID flip chip on a paper or plastic substrate is one of the most competitive technologies for low cost smart label manufacturing. Anisotropically conductive adhesive (ACA) and semiautomatic heat-sealing machine were developed to accomplish the smart label inlay assembly process by interconnecting the RFID flip chip on aluminum antenna/plastic substrate. Fast cure of ACA in seconds at low temperatures enables to speed up the assembly processing, as well as to utilize the low-cost temperature-sensitive substrate like PET. Advantages of this environmentally friendly process make it quite possible to be applied in a high speed roll-to-roll smart label line. Reliability assessment on the electric and mechanic properties demonstrated that the products exceeded the specification requirements