pcb集成增材制造充气波导装配用3D打印贴合接头研究

J. Sorocki, K. Wincza, S. Gruszczynski, I. Piekarz
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引用次数: 0

摘要

为了降低制造成本和组装工作量,本文研究了3D打印贴合接头用于最近推出的印刷电路板(PCB)集成充气波导(AF-WG)的组装。设计和测试了各种连接结构,以在金属涂层3D打印u形波导外壳的法兰和pcb上的接地平面(作为波导壁之一)之间提供压力辅助的低阻力接触。以上是最初提出的通孔螺钉连接的替代方案,尽管低阻力需要额外的部件和更复杂的组装。开发了典型的可分离球和悬臂式卡扣接头,并将其以不同的螺距集成到为实验研究制造的测试车辆中,该试验研究是在9 GHz至12 GHz带宽范围内工作的通过贴片微带到AF-WG背靠背配置的过渡,中间有长波导段。所得结果表明,在适当的间距下,球接头在电路的总功率损耗方面可以提供与螺钉接头相当的性能,使其更适合用于高集成电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on 3D Printed Snap-Fit Joints for Assembly of PCB-Integrated Additively Fabricated Air-Filled Waveguide
In this paper, 3D printed snap-fit joints are investigated for assembly of the recently introduced Printed Circuit Board (PCB) integrated air-filled waveguide (AF-WG) to reduce the fabrication cost and assembly effort. Various joint constructions were designed and tested to provide pressure-assisted low-resistance contact between flanges of the metal-coated 3D printed U-shaped waveguide shell and on-PCB ground plane that serves as one of the guide's walls. The above is an alternative to the originally proposed through-hole screw joint that although low resistance requires extra parts and a more complicated assembly. Exemplary separable ball and cantilever snap-fit joints were developed and integrated at different pitches into test vehicles fabricated for the experimental study being a through-patch microstrip to AF-WG transition in back-to-back configuration operating within 9 GHz to 12 GHz bandwidth with long waveguide section in-between. The obtained results show that a ball joint can provide comparable performance in terms of total power loss of the circuit to a screw joint when properly spaced making it superior to use for highly-integrated circuits.
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