Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta
{"title":"带场极板的GaN HEMT等效通道温度","authors":"Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta","doi":"10.1109/ICDCS48716.2020.243582","DOIUrl":null,"url":null,"abstract":"This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.","PeriodicalId":307218,"journal":{"name":"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)","volume":"135 5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Equivalent Channel Temperature in GaN HEMT with Field Plate\",\"authors\":\"Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta\",\"doi\":\"10.1109/ICDCS48716.2020.243582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.\",\"PeriodicalId\":307218,\"journal\":{\"name\":\"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)\",\"volume\":\"135 5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICDCS48716.2020.243582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICDCS48716.2020.243582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Equivalent Channel Temperature in GaN HEMT with Field Plate
This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.