带场极板的GaN HEMT等效通道温度

Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta
{"title":"带场极板的GaN HEMT等效通道温度","authors":"Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta","doi":"10.1109/ICDCS48716.2020.243582","DOIUrl":null,"url":null,"abstract":"This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.","PeriodicalId":307218,"journal":{"name":"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)","volume":"135 5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Equivalent Channel Temperature in GaN HEMT with Field Plate\",\"authors\":\"Sachin Kumar, S. Chander, DS Rawal Samuder Gupta, Mridula Gupta\",\"doi\":\"10.1109/ICDCS48716.2020.243582\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.\",\"PeriodicalId\":307218,\"journal\":{\"name\":\"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)\",\"volume\":\"135 5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICDCS48716.2020.243582\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 5th International Conference on Devices, Circuits and Systems (ICDCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICDCS48716.2020.243582","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文分析了氮化镓(GaN)基场极板高电子迁移率晶体管(HEMT)的电参数漏极电流。在温度分布的基础上,利用计算机辅助设计(TCAD)仿真软件进行了分析。通道温度被用作主要参数,因为它负责器件电气性能的退化。采用栅极长度为0.25 μm,带场极板的GaN HEMT进行了模拟。对该装置的等效通道温度进行了研究,在热分析研究中具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Equivalent Channel Temperature in GaN HEMT with Field Plate
This work presents the analysis of electrical parameter drain current of gallium nitride (GaN) based high electron mobility transistor (HEMT) with field plate. The analysis has been done by using the technology computer-aided design (TCAD) simulation software on the basis of temperature profile. Channel temperature is used as the main parameter because this is responsible for degradation of electrical performance of the device. GaN HEMT of gate length 0.25 μm with field plate has been used for simulations. Equivalent channel temperature has been studied for this device which is more relevant in the study of thermal analysis.
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