标准CMOS工艺中用于低光可见光成像的开路电压像素

R. Fragasse, R. Tantawy, D. Smith, S. Ay, W. Khalil
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引用次数: 0

摘要

在可见光和近红外光谱范围内,提出了一种利用正向偏置区域光电二极管的成像像素单元拓扑结构。将开路电压像素(VocP)架构应用于可见光成像,可以提高光电探测器的有效响应率,从而在宽光谱范围内显著提高像素灵敏度,同时降低对光电二极管和所选CMOS工艺的要求。理论分析显示了VocP的运行、响应和性能优势。像素拓扑已经在0.13 μm标准CMOS技术上进行了仿真验证,并且还嵌入到端到端读出系统模型中,以显示与传统4T-APS相比的预计性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Open-Circuit Voltage Pixel for Low-Light Visible Imaging in a Standard CMOS Process
An imaging pixel unit-cell topology leveraging a photodiode in the forward-bias region is proposed for the visible and near-infrared spectral ranges. The open-circuit voltage pixel (VocP) architecture applied to visible imaging allows for improvement in the effective responsivity of the photodetector, leading to significant enhancement in pixel sensitivity across a wide spectral-range, while relaxing the requirements on the photodiode, and chosen CMOS process. Theoretical analysis is presented to show the operation, response, and performance benefits of the VocP. The pixel topology has been verified in simulation in a 0.13 μm standard CMOS technology, and has also been embedded in an end-to-end readout system model to show the projected performance compared against a conventional 4T-APS.
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