65nm LSTP低电压高密度存储单元库的设计

Akshat Saxena, Swapnil Bansal, D. Sharma, Payal Kumari, Sandeep Kumar Singh, Priya Kapil, Belal Iqbal, Anuj Grover
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引用次数: 1

摘要

在先进的高性能数字soc中,嵌入式sram占据了近70%的芯片面积。因此,优化ram的密度、功耗和性能是非常重要的。本文介绍了一种高密度SRAM存储单元套件的设计,该存储单元由不同配置的irw 8T单元和传统的6T单元组成,采用65nm低待机功耗(LSTP)技术节点。评估了采用辅助方案降低SRAM单元的最小工作电压($V_{\min}$)的效果。我们发现,在$V_{\min}$=1.08V时,传统的6T电池比IRIW的8T电池密度高25%,而在$V_{\min}$=0.81V时,具有写辅助的8T电池密度约为7%,漏电流降低33%,性能优于6T电池。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design Of High Density Memory Cell Library For Low Voltage Operation In 65nm LSTP Technology
In advanced high-performance digital SoCs, embedded SRAMs occupy nearly 70% of die area. Therefore, optimizing SRAMs for density, power consumption, and performance is very important. This paper presents the design of a high-density SRAM memory cell suite comprising of different configurations of IRIW 8T cell and a conventional 6T cell in 65nm low standby power (LSTP) technology node. The effect of using assist schemes to lower minimum operational voltage ($V_{\min}$) of the SRAM cell is evaluated. We show that while at $V_{\min}$=1.08V, a conventional 6T cell is 25% denser than a IRIW 8T cell, at $V_{\min}$=0.81V, 8T cell with write assist is around 7% denser and has 33% lower leakage and better performance than a 6T cell.
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