{"title":"采用生产就绪SiGe HBT技术的移动通信低噪声放大器","authors":"U. Erben, A. Schuppen, H. Dietrich, H. Schumacher","doi":"10.1109/ESSDERC.1997.194438","DOIUrl":null,"url":null,"abstract":"A production ready SiGe HBT technology was used to realize a stage GHz low noise ampli er This ampli er exhibits a minimum noise gure of dB with up to dB associated gain at a supply voltage of V and a current of mA Input and output matching can be obtained by using bond wire inductances The third order input intercept point was observed at dBm","PeriodicalId":424167,"journal":{"name":"27th European Solid-State Device Research Conference","volume":"124 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Low-Noise Amplifier for Mobile Communications using a Production Ready SiGe HBT Technology\",\"authors\":\"U. Erben, A. Schuppen, H. Dietrich, H. Schumacher\",\"doi\":\"10.1109/ESSDERC.1997.194438\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A production ready SiGe HBT technology was used to realize a stage GHz low noise ampli er This ampli er exhibits a minimum noise gure of dB with up to dB associated gain at a supply voltage of V and a current of mA Input and output matching can be obtained by using bond wire inductances The third order input intercept point was observed at dBm\",\"PeriodicalId\":424167,\"journal\":{\"name\":\"27th European Solid-State Device Research Conference\",\"volume\":\"124 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-09-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"27th European Solid-State Device Research Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESSDERC.1997.194438\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"27th European Solid-State Device Research Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSDERC.1997.194438","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low-Noise Amplifier for Mobile Communications using a Production Ready SiGe HBT Technology
A production ready SiGe HBT technology was used to realize a stage GHz low noise ampli er This ampli er exhibits a minimum noise gure of dB with up to dB associated gain at a supply voltage of V and a current of mA Input and output matching can be obtained by using bond wire inductances The third order input intercept point was observed at dBm