短沟道SOI MOSFET负电导模型

J. Lai, T. Fabian, S.T. Liu
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引用次数: 2

摘要

一个短沟道SOI(绝缘体上硅)n沟道MOSFET,当源极/漏极连接到埋藏的氧化物时,可能在输出特性中显示负电导。这种现象最近被归因于温度效应。然而,温度效应太小,不足以解释观测结果。基于电场中电荷粒子相互作用的理论(在冲击电离产生的通道电子流和空穴流之间),推导了一个解释观察到的负电导的物理模型。为了便于验证,在修改后的SPICE程序中实现了该模型。该模型适用于在V/sub GS/=5.0 V.>条件下,在薄的低缺陷SIMOX材料上制作的短沟道SOI n沟道MOSFET
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Negative conductance model for short-channel SOI MOSFET
A short-channel SOI (silicon on insulator) n-channel MOSFET when source/drain junctions bottom out to the buried oxide may display a negative conductance in the output characteristics when the body tie is connected to the source. This phenomenon has been recently attributed to a temperature effect. However, the temperature effect is too small to account for the observation. Based on the theory of charge particle interaction in an electric field (between the channel electron flow and hole flow generated by impact ionization), a physical model is derived to account for the observation of the negative conductance. The model is implemented in a modified SPICE program to facilitate the verification. The model fits to a short-channel SOI n-channel MOSFET made on a thin low-defect SIMOX material at V/sub GS/=5.0 V.<>
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