L. Boccia, A. Emanuele, E. Arnieri, A. Shamsafar, G. Amendola
{"title":"基于扇形角的印刷功率组合器","authors":"L. Boccia, A. Emanuele, E. Arnieri, A. Shamsafar, G. Amendola","doi":"10.23919/EUMC.2012.6459084","DOIUrl":null,"url":null,"abstract":"In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.","PeriodicalId":266910,"journal":{"name":"2012 42nd European Microwave Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Printed power-combiner based on sectoral horns\",\"authors\":\"L. Boccia, A. Emanuele, E. Arnieri, A. Shamsafar, G. Amendola\",\"doi\":\"10.23919/EUMC.2012.6459084\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.\",\"PeriodicalId\":266910,\"journal\":{\"name\":\"2012 42nd European Microwave Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 42nd European Microwave Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/EUMC.2012.6459084\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 42nd European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EUMC.2012.6459084","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.
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