走向一个完整的直接混合键合D2W集成流程:已知好的模具和模具平面化模块的发展

2019 International 3D Systems Integration Conference (3DIC) Pub Date : 2019-10-01 DOI:10.1109/3DIC48104.2019.9058783

E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp, M. Zussy, G. Mauguen, C. Castan, L. Sanchez, A. Jouve, F. Fournel, S. Chéramy

{"title":"走向一个完整的直接混合键合D2W集成流程:已知好的模具和模具平面化模块的发展","authors":"E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp, M. Zussy, G. Mauguen, C. Castan, L. Sanchez, A. Jouve, F. Fournel, S. Chéramy","doi":"10.1109/3DIC48104.2019.9058783","DOIUrl":null,"url":null,"abstract":"Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development\",\"authors\":\"E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp, M. Zussy, G. Mauguen, C. Castan, L. Sanchez, A. Jouve, F. Fournel, S. Chéramy\",\"doi\":\"10.1109/3DIC48104.2019.9058783\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.\",\"PeriodicalId\":440556,\"journal\":{\"name\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"19 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC48104.2019.9058783\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058783","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 6

摘要

对于下一代3DIC来说，晶圆对晶圆的堆叠非常有前途，因为它提供了以小互连间距组装多个晶圆的能力。本文提出了一种D2W HB工艺的整体集成方案，以增强其鲁棒性和与微电子工业的经济相关性。首先，开发了一种与杂化键合兼容的KGD策略。通过测试的焊盘，成功地验证了D2W键合。其次，介绍了叠模平面化的研究进展。

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Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development

Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.

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2019 International 3D Systems Integration Conference (3DIC)

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