圆片上谐波测量的障碍

K. Muhonen
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引用次数: 1

摘要

随着移动电话对频谱需求的不断增加,对杂散发射的规范也越来越严格。谐波可以分成用于其他服务的频段,因此对这些谐波的预先评估在产品开发中至关重要。圆片上谐波工作台用于快速评估材料和设计,而无需构建最终产品来预测谐波性能。谐波测量并不新鲜;但高功率(4瓦)的晶圆上谐波测量存在尚未解决的障碍。低无源互调(PIM)组件,探头选择,连接器选择和工作台配置都可以构建具有足够低系统噪声的测量系统,以便能够评估移动应用的最先进技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hurdles to on-wafer harmonic measurements
With the ever increasing need for spectrum the mobile phones, specifications are tougher for spurious emissions. Harmonics can fall into bands that are used for other services so prior evaluation of those harmonics is critical in product development. An on-wafer harmonic bench is used for fast evaluation of material and designs without having to build a final product to predict what the harmonic performance will be. Harmonic measurements are not new; but high power (4 watts), on-wafer harmonic measurements present hurdles that have not been solved. Low passive intermodulation (PIM) components, probe selection, connector selection and bench configuration all play into building a measurement system with low enough system noise to be able to evaluate the state-of-the-art technologies for mobile applications.
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