高效率高可靠性SiC MOSFET与单片集成肖特基整流器

F. Hsu, C. Yen, C. Hung, Hsiang-Ting Hung, Chwan-Ying Lee, L. Lee, Y. Huang, Tzong-Liang Chen, Pei-Ju Chuang
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引用次数: 44

摘要

本文提出了一种结势垒控制肖特基整流器集成碳化硅MOSFET (SiC JMOS),它将双植入MOSFET (DMOS)和结势垒控制肖特基二极管(JBS)融合在一个单片碳化硅器件中,而没有额外的工艺和面积损失。与传统的SiC DMOS相比,JMOS器件具有更低的反向传导压降。VSD改善了47%。由于单极器件的特性,在较低的反向恢复电荷(Qrr)和最大反向恢复电流(IRMax)等动态性能上也具有优势。因此,JMOS的Qrr和IRMax分别降低了54%和40%。集成JBS还可以防止在SiC MOSFET中寄生体二极管导通时,由于注入的少数载流子重新组合而导致位错缺陷转变为层错而导致的潜在失效。在本工作中,我们进行了特性比较,并建立了测试平台,验证了SiC JMOS相对于传统SiC DMOS的效率和可靠性的提高。实验结果表明,该方法能以较低的成本和较高的功率密度获得较好的系统性能和可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High efficiency high reliability SiC MOSFET with monolithically integrated Schottky rectifier
A junction barrier controlled Schottky rectifier integrated silicon carbide MOSFET (SiC JMOS) is proposed in this paper, which merged a double implanted MOSFET (DMOS) and junction barrier controlled Schottky diode (JBS) in a monolithic SiC device without any additional process and area penalty. JMOS device in this work exhibits a lower reverse conduction voltage drop than conventional SiC DMOS. There is a 47% improvement on VSD. There's also superior in dynamic performances such like lower reverse recovery charge (Qrr) and maximum reverse recovery current (IRMax) due to characteristics of unipolar devices. As a result, JMOS is 54% lower in Qrr and 40% lower in IRMax. The integrated JBS could also prevent the potential failure caused by the transformation of dislocation defects into stacking faults due to the recombination of injected minority carriers when parasitic body diode in SiC MOSFET was turned on. In this work, we make characteristics comparison and build a testing platform to verify the efficiency and reliability improvement of SiC JMOS from conventional SiC DMOS. The experiment result shows that we could gain better system performance and reliability with less cost and higher power density.
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