{"title":"用局部厚度减薄工艺制备硅光子器件的垂直锥度结构","authors":"S. Abe, H. Hara, S. Masuda, H. Yamada","doi":"10.23919/MOC52031.2021.9598154","DOIUrl":null,"url":null,"abstract":"We have developed a simple fabrication process of low-insertion-loss vertical-taper structures which can locally optimize the Si thickness of silicon-photonic devices. Fabricated vertical-taper structures realized the conversion of Si-waveguide thickness from 400 nm to 220 nm, whose insertion loss was measured to be less than 0.5 dB.","PeriodicalId":355935,"journal":{"name":"2021 26th Microoptics Conference (MOC)","volume":"112 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fabrication of Vertical-Taper Structures for Silicon Photonic Devices by Local-Thickness-Thinning Process\",\"authors\":\"S. Abe, H. Hara, S. Masuda, H. Yamada\",\"doi\":\"10.23919/MOC52031.2021.9598154\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have developed a simple fabrication process of low-insertion-loss vertical-taper structures which can locally optimize the Si thickness of silicon-photonic devices. Fabricated vertical-taper structures realized the conversion of Si-waveguide thickness from 400 nm to 220 nm, whose insertion loss was measured to be less than 0.5 dB.\",\"PeriodicalId\":355935,\"journal\":{\"name\":\"2021 26th Microoptics Conference (MOC)\",\"volume\":\"112 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 26th Microoptics Conference (MOC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/MOC52031.2021.9598154\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 26th Microoptics Conference (MOC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MOC52031.2021.9598154","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Fabrication of Vertical-Taper Structures for Silicon Photonic Devices by Local-Thickness-Thinning Process
We have developed a simple fabrication process of low-insertion-loss vertical-taper structures which can locally optimize the Si thickness of silicon-photonic devices. Fabricated vertical-taper structures realized the conversion of Si-waveguide thickness from 400 nm to 220 nm, whose insertion loss was measured to be less than 0.5 dB.
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