高填充系数电气绕组的热性能:浸润与非浸润

Leif Siesing, A. Reinap, Mats Andersson
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引用次数: 51

摘要

本文比较了渗铜绕组和非渗铜绕组的热性能。重点是热导率在径向上的绕组。由于样品的制造方法,样品的填充系数大于65%。利用瞬态平面源技术制备和测量了样品,并与有限元模拟和Hashin和Shtrikman近似进行了比较。结果表明,非浸润绕组和浸润绕组之间存在很大的差异,并且测量值、有限元模拟和Hashin和Shtrikman近似之间具有很好的一致性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Thermal properties on high fill factor electrical windings: Infiltrated vs non infiltrated
This paper presents a comparison of the thermal properties between infiltrated and non-infiltrated copper windings. The focus is on thermal conductivity in the radial direction on the winding. The samples have a fill factor above 65 % due to the manufacturing method of the samples. Samples are produced and measured with the transient plane source technique and then compared to FEM simulations and the Hashin and Shtrikman approximation. The results show a considerable difference between a non-infiltrated and an infiltrated winding, as well as a good agreement between measurements, FEM simulations and the Hashin and Shtrikman approximation.
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