未来的单片系统:对工程教育的影响

Hugo De Man
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引用次数: 7

摘要

深亚微米(DS)技术正在迅速导致在处理器-存储器级别设计的片上系统(SoC),并且包含许多混合信号甚至射频架构。然而,DS技术的开发将严重依赖于全球系统工程师的可用性,这些工程师能够在新颖的硅架构中弥合以软件为中心的系统思维和硬件软件实现之间的差距。这就要求我们重新思考目前的工程学院,它们没有很好地解决全球系统工程方面的问题。设计院的概念被引入其中,基于有远见的系统设计演示,新的方法,工具,图书馆和课程被创建并在全球网络上分发。设计学院为新的设计范式提供了一个学习学校,并为全球系统设计师和具有系统设计意识的教师的教育形成了理想的环境。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Future systems-on-a-chip: impact on engineering education
Deep-Submicron (DS) technology is rapidly leading to systems-on-a-chip (SoC) designed at the processor-memory level, and containing a lot of mixed-signal and even RF architectures. However, exploitation of DS technology will depend critically on the availability of global system engineers able to bridge the gap between software-centric system thinking and hardware-software implementation, in novel silicon architectures. This requires a rethinking of present engineering schools which are not well equipped to tackle global system engineering aspects. The concept of design institute is introduced where, based on visionary system design demonstrators, new methodologies, tools, libraries and courses are created and distributed over the global network. Design institutes provide a learning school for new design paradigms and form the ideal environment for the education of global system designers and system design minded faculty.
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