使用后硅截断操作数宽度的容变DSP硬件设计方法

Keerthi Kunaparaju, S. Narasimhan, S. Bhunia
{"title":"使用后硅截断操作数宽度的容变DSP硬件设计方法","authors":"Keerthi Kunaparaju, S. Narasimhan, S. Bhunia","doi":"10.1109/VLSID.2011.58","DOIUrl":null,"url":null,"abstract":"With increasing parameter variations in nanoscale technologies, computational blocks in Digital Signal Processing (DSP) hardware become increasingly vulnerable to variation-induced delay failures. These failures can significantly affect the Quality of Service (QoS) for a DSP chip leading to degradation in parametric yield. Existing post-silicon calibration and repair approaches, which rely on adaptation of circuit operating parameters such as voltage, frequency or body bias, typically incur large delay or power overhead in order to maintain QoS. In this paper, we present a novel low overhead approach of healing DSP chips by commensurately truncating the operand width based on its process corner. The proposed approach exploits the fact that critical timing paths in DSP data paths typically originate from the least significant bits (LSBs). This condition can also be satisfied by skewing the path delay distribution during logic synthesis or gate sizing. Hence, truncation of the LSBs, realized by setting them at constant values, can effectively reduce the delay of a unit, thereby avoiding delay failures. We also note that truncation of LSBs typically has minimal impact on QoS. Besides, efficient choice of truncation bits and values can minimize the impact on QoS. We propose appropriate design time modifications including insertion of low-overhead truncation circuit and gate sizing to maximize the delay improvement with truncation. Simulation results for a Discrete Cosine Transform (DCT) application at 45nm technology show large improvement in yield (41.6%) with up to 5X savings in power compared to existing healing approaches.","PeriodicalId":371062,"journal":{"name":"2011 24th Internatioal Conference on VLSI Design","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-01-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"VaROT: Methodology for Variation-Tolerant DSP Hardware Design Using Post-Silicon Truncation of Operand Width\",\"authors\":\"Keerthi Kunaparaju, S. Narasimhan, S. Bhunia\",\"doi\":\"10.1109/VLSID.2011.58\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With increasing parameter variations in nanoscale technologies, computational blocks in Digital Signal Processing (DSP) hardware become increasingly vulnerable to variation-induced delay failures. These failures can significantly affect the Quality of Service (QoS) for a DSP chip leading to degradation in parametric yield. Existing post-silicon calibration and repair approaches, which rely on adaptation of circuit operating parameters such as voltage, frequency or body bias, typically incur large delay or power overhead in order to maintain QoS. In this paper, we present a novel low overhead approach of healing DSP chips by commensurately truncating the operand width based on its process corner. The proposed approach exploits the fact that critical timing paths in DSP data paths typically originate from the least significant bits (LSBs). This condition can also be satisfied by skewing the path delay distribution during logic synthesis or gate sizing. Hence, truncation of the LSBs, realized by setting them at constant values, can effectively reduce the delay of a unit, thereby avoiding delay failures. We also note that truncation of LSBs typically has minimal impact on QoS. Besides, efficient choice of truncation bits and values can minimize the impact on QoS. We propose appropriate design time modifications including insertion of low-overhead truncation circuit and gate sizing to maximize the delay improvement with truncation. Simulation results for a Discrete Cosine Transform (DCT) application at 45nm technology show large improvement in yield (41.6%) with up to 5X savings in power compared to existing healing approaches.\",\"PeriodicalId\":371062,\"journal\":{\"name\":\"2011 24th Internatioal Conference on VLSI Design\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-01-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 24th Internatioal Conference on VLSI Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSID.2011.58\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 24th Internatioal Conference on VLSI Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSID.2011.58","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

随着纳米技术参数变化的增加,数字信号处理(DSP)硬件中的计算块越来越容易受到变化引起的延迟故障的影响。这些故障会严重影响DSP芯片的服务质量(QoS),导致参数成品率下降。现有的后硅校准和修复方法依赖于电路工作参数(如电压、频率或体偏置)的自适应,为了保持QoS,通常会产生较大的延迟或功率开销。在本文中,我们提出了一种新的低开销的修复DSP芯片的方法,即根据其过程角相应地截断操作数宽度。所提出的方法利用了DSP数据路径中的关键时序路径通常来自最低有效位(LSBs)的事实。这个条件也可以通过在逻辑合成或栅极尺寸调整时扭曲路径延迟分布来满足。因此,通过将lsb设置为恒定值来截断lsb,可以有效地减少单元的延迟,从而避免延迟失败。我们还注意到,lsdb的截断通常对QoS的影响最小。此外,截断位和截断值的有效选择可以最大限度地减少对QoS的影响。我们提出适当的设计时间修改,包括插入低开销截断电路和栅极尺寸,以最大限度地提高截断延迟。45纳米技术的离散余弦变换(DCT)应用的仿真结果显示,与现有的修复方法相比,产量大幅提高(41.6%),功耗节省高达5倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
VaROT: Methodology for Variation-Tolerant DSP Hardware Design Using Post-Silicon Truncation of Operand Width
With increasing parameter variations in nanoscale technologies, computational blocks in Digital Signal Processing (DSP) hardware become increasingly vulnerable to variation-induced delay failures. These failures can significantly affect the Quality of Service (QoS) for a DSP chip leading to degradation in parametric yield. Existing post-silicon calibration and repair approaches, which rely on adaptation of circuit operating parameters such as voltage, frequency or body bias, typically incur large delay or power overhead in order to maintain QoS. In this paper, we present a novel low overhead approach of healing DSP chips by commensurately truncating the operand width based on its process corner. The proposed approach exploits the fact that critical timing paths in DSP data paths typically originate from the least significant bits (LSBs). This condition can also be satisfied by skewing the path delay distribution during logic synthesis or gate sizing. Hence, truncation of the LSBs, realized by setting them at constant values, can effectively reduce the delay of a unit, thereby avoiding delay failures. We also note that truncation of LSBs typically has minimal impact on QoS. Besides, efficient choice of truncation bits and values can minimize the impact on QoS. We propose appropriate design time modifications including insertion of low-overhead truncation circuit and gate sizing to maximize the delay improvement with truncation. Simulation results for a Discrete Cosine Transform (DCT) application at 45nm technology show large improvement in yield (41.6%) with up to 5X savings in power compared to existing healing approaches.
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