{"title":"温度对高熔点铋系焊料拉伸性能的影响","authors":"Haidong Zhang, I. Shohji, M. Shimoda, H. Watanabe","doi":"10.1109/EPTC.2014.7028316","DOIUrl":null,"url":null,"abstract":"Tensile properties of three Bi-bearing lead-free solder were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength decreases with increasing temperature in all solder investigated. Although tensile strength of Bi-bearing solder is lower than that of Pb-2.5Ag-2.5Sn at 25°C, tensile strength of Bi-1.0Ag-0.3Sn-0.03Ge (mass%) and Bi-2.5Ag (mass%) are analogous to and higher than that of Pb-2.5Ag-2.5Sn respectively at a temperature of 125°C or more. 0.2% proof stress of Bi-2.5Ag increases with increasing temperature. Although the proof stress of Bi-2.5Ag is the lowest at 25°C, it was the highest at 125°C and 175°C among solder investigated. Elongation of Bi-bearing lead-free solder improves with increasing temperature. In particular, the improvement of elongation of Bi is significant and it improves up to approximately 60 % at a temperature of 125°C or more.","PeriodicalId":115713,"journal":{"name":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Effect of temperature on tensile properties of high-melting point Bi system solder\",\"authors\":\"Haidong Zhang, I. Shohji, M. Shimoda, H. Watanabe\",\"doi\":\"10.1109/EPTC.2014.7028316\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Tensile properties of three Bi-bearing lead-free solder were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength decreases with increasing temperature in all solder investigated. Although tensile strength of Bi-bearing solder is lower than that of Pb-2.5Ag-2.5Sn at 25°C, tensile strength of Bi-1.0Ag-0.3Sn-0.03Ge (mass%) and Bi-2.5Ag (mass%) are analogous to and higher than that of Pb-2.5Ag-2.5Sn respectively at a temperature of 125°C or more. 0.2% proof stress of Bi-2.5Ag increases with increasing temperature. Although the proof stress of Bi-2.5Ag is the lowest at 25°C, it was the highest at 125°C and 175°C among solder investigated. Elongation of Bi-bearing lead-free solder improves with increasing temperature. In particular, the improvement of elongation of Bi is significant and it improves up to approximately 60 % at a temperature of 125°C or more.\",\"PeriodicalId\":115713,\"journal\":{\"name\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2014.7028316\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2014.7028316","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of temperature on tensile properties of high-melting point Bi system solder
Tensile properties of three Bi-bearing lead-free solder were investigated and compared with that of Pb-rich Pb-2.5Ag-2.5Sn (mass%) solder. Tensile strength decreases with increasing temperature in all solder investigated. Although tensile strength of Bi-bearing solder is lower than that of Pb-2.5Ag-2.5Sn at 25°C, tensile strength of Bi-1.0Ag-0.3Sn-0.03Ge (mass%) and Bi-2.5Ag (mass%) are analogous to and higher than that of Pb-2.5Ag-2.5Sn respectively at a temperature of 125°C or more. 0.2% proof stress of Bi-2.5Ag increases with increasing temperature. Although the proof stress of Bi-2.5Ag is the lowest at 25°C, it was the highest at 125°C and 175°C among solder investigated. Elongation of Bi-bearing lead-free solder improves with increasing temperature. In particular, the improvement of elongation of Bi is significant and it improves up to approximately 60 % at a temperature of 125°C or more.
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