无焊剂回流焊的等离子处理工艺

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI:10.1109/ECTC.2001.927997

K. Wolter, T. Zerna, R. Deltschew, H. Neumann

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引用次数: 6

摘要

等离子体处理在无焊剂焊接中的应用在波峰焊领域中是众所周知的。等离子体处理印刷电路板(pcb)与固体焊料沉积(ssd)使得有可能消除在回流焊接过程中的应用传统的助焊剂。然而，主要问题是需要在等离子处理和回流焊接之间存储pcb，而不需要表面再氧化。因此，有必要寻找方法来实现已知的等离子焊接工艺，在等离子处理过程中在固态硬盘顶部形成保护膜。本文研究了共晶SnPb钎料的表面改性与工艺参数的关系。等离子体处理后，检测到金属氟化物和聚合物形成。回流焊影响焊料表面聚合物层的数量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Plasma treatment process for fluxless reflow soldering

The application of plasma treatment for fluxless soldering is known in the field of wave soldering. Plasma treatment of printed circuit boards (PCBs) with solid solder deposits (SSDs) makes it possible to eliminate the application of conventional flux in reflow soldering process. However, the main problem is the need of storing PCBs between plasma treatment and reflow soldering without reoxidation of surfaces. Therefore it is necessary to fund ways to realize the known plasma soldering process with formation of protective film on the top of the SSDs during the plasma treatment. This work deals with the dependence of surface modification of eutectic SnPb solder materials on process parameters. After plasma treatment is detected both metal fluoride and polymer formation. The reflow soldering influences the amount of polymer layers on the solder surface.

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来源期刊

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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