在物联网应用的宽压力范围内对封装MEMS热传感器的热性能进行建模

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS) Pub Date : 2019-11-01 DOI:10.1109/COMCAS44984.2019.8958080

Moshe Avraham, A. Shabtay, Dima Shlenkevitch, S. Stolyarova, Tanya Blank, Y. Nemirovsky

{"title":"在物联网应用的宽压力范围内对封装MEMS热传感器的热性能进行建模","authors":"Moshe Avraham, A. Shabtay, Dima Shlenkevitch, S. Stolyarova, Tanya Blank, Y. Nemirovsky","doi":"10.1109/COMCAS44984.2019.8958080","DOIUrl":null,"url":null,"abstract":"This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.","PeriodicalId":276613,"journal":{"name":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications\",\"authors\":\"Moshe Avraham, A. Shabtay, Dima Shlenkevitch, S. Stolyarova, Tanya Blank, Y. Nemirovsky\",\"doi\":\"10.1109/COMCAS44984.2019.8958080\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.\",\"PeriodicalId\":276613,\"journal\":{\"name\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"volume\":\"6 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/COMCAS44984.2019.8958080\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/COMCAS44984.2019.8958080","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文重点研究了晶圆级封装MEMS热传感器的热性能，其中压力在深真空(0.1 Pa)和大气压之间变化。模拟基于商业软件，并通过建模和测量得到证实。热时间常数的实测数据与模拟结果吻合较好。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modeling the thermal performance of a packaged MEMS thermal sensor at wide pressure range for IoT applications

This paper focuses on the thermal performance of a wafer level packaged MEMS thermal sensor, where the pressure varies between deep vacuum (0.1 Pa) and atmospheric pressure. The simulations are based on commercial software and are corroborated by modeling and measurements. There is a good agreement between the measured experimental data for the thermal time constant and the modeling and simulations.

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来源期刊

2019 IEEE International Conference on Microwaves, Antennas, Communications and Electronic Systems (COMCAS)

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