60 - 325ghz基片集成平面毫米波天线阵列的设计与测量

Zhi Ning Chen, X. Qing, S. Yeap, Junfeng Xu
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引用次数: 3

摘要

毫米波频段天线的开发从设计、制造到测量都面临着许多独特的挑战。这种设计通常存在高损耗和难以集成到电路中的问题。由于昂贵的测试设置、对被测天线与馈电系统之间可靠连接的关键要求、定制的校准设置和程序,制造通常与临界公差相关,这是最棘手的问题之一。利用基板集成技术,天线将被制造到基板上,以减少成本、尺寸、传输损耗,并增强与电路的集成。本讲座将首先介绍毫米波天线设计和基板集成技术的设计挑战。之后,介绍了最近开发的用于60-270 GHz应用的基片集成高增益天线阵列,并介绍了最新构建的高达325 GHz的测量系统。最后,对毫米波和亚毫米波频段天线设计中基片集成技术的发展进行了评述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and measurement of substrate-integrated planar millimeter wave antenna arrays at 60–325 GHz
Antenna development at mmW bands has many unique challenges from design, fabrication to measurement. The designs usually suffer from high losses and difficulty in integrating into circuits. The fabrication is often associated with critical tolerance as one of the toughest issues because of expensive testing setup, critic requirements for reliable connection between antenna under test and feeding system, customized calibration setup and procedures. Using substrate-integration technology, the antennas will be fabricated onto substrate to reduce cost, size, transmission loss, and enhance integration into circuits. This talk will brief the design challenges in mmW antenna design and substrate-integration technology first. After that, recently developed substrate-integrated high-gain antenna arrays for 60-270 GHz applications are exemplified with the introduction of the latest built measurement system up to 325 GHz. Last, the comments on the development of the substrate-integration technology in antenna design at mmW and submmW bands are provided.
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