芯片多处理器非易失性存储器中基于可重构最后缓存级别的电源管理

Furat Al-Obaidy, Arghavan Asad, F. Mohammadi
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引用次数: 4

摘要

随着技术的扩展和新型嵌入式应用的并行性水平的提高,多核芯片多处理器(CMP)得到了发展。在这种情况下,在电池寿命有限的未来cmp中,功耗是一个关键问题。对于未来的cmp架构,最近引入了Last Level Cache (LLC)的3D堆叠,作为对抗2D集成性能挑战的新方法。然而,由于密集集成,与2d中的传统缓存架构相比,llc的3D设计会导致更多的泄漏功率利用率。在这项工作中,我们提出了一种用于未来cmp的节能可重构混合最后一级缓存架构。本文提出的混合结构SRAM存储器结合了STT-RAM技术,利用了传统技术和新技术的特点。实验结果表明,在多程序和多线程应用中,该方法能最大限度地降低功耗。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Power-Management based on Reconfigurable Last-Cache level on Non-volatile Memories in Chip-Multi processors
with technology scaling and increasing parallelism levels of new embedded applications, multi-cores in chip-multiprocessors (CMP) has been increased. In this context, power consumption acts a critical issue concern in future CMPs with restricted of battery lifetime. For future CMPs architecting, 3D stacking of Last Level Cache (LLC) has been recently introduced as a new methodology to combat the performance challenges of 2D integration. However, the 3D design of LLCs incurs more leakage power utilization compared to conventional cache architectures in 2Ds due to dense integration. We present in this work a power-efficient reconfigurable hybrid last level cache architecture for future CMPs. The proposed hybrid architecture SRAM memory is incorporated with STT-RAM technology by using the characteristics for both new and traditional technologies. The experimental results show that the designed method minimizes power consumption under multi-programmed and multithreaded applications.
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