层次聚类、分解和多级宏建模——解决大尺寸和超大尺寸组合电路问题的有效工具(仅摘要)

R. Bazylevych
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引用次数: 0

摘要

本文综述了作者及其科研小组近年来在包括VLSI和SoC在内的电子器件物理设计自动化中出现的组合非多项式大尺寸和超大尺寸问题方面的研究成果。最优电路约简方法被认为是识别电路分层簇结构的较好工具。它可以解决各种各样的问题,包括具有给定约束的强制分层划分、包装和放置。这些问题的通用方法是在递归的基础上发展起来的,使用高质量的全局和局部优化算法来解决唯一的非高规模任务。实验验证了所提出方法的有效性。对于一些著名的测试,第一次就获得了最佳结果,而在其他一些情况下,结果得到了改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hierarchial clasterization, decomposition and multilevel macromodeling—the effective and efficient tools to solve the sigh and very high size combinatorial circuit type problems (abstract only)
The paper gives a generalization of author and his scientific group recent works in combinatorial non-polynomial high and very high size problems that appear in physical design automation of electronic devices including VLSI and SoC. The optimal circuit reduction method is marked as the better tool to recognize the hierarchical cluster structure of the circuit. Its possibilities to solve the wide spectrum of various problems, including forced hierarchical partitioning with given constraints, packaging, and placement are generalized. The common approach to these problems is developed on the basis of recursive using high quality algorithms of global and local optimization to the unique not high size task. The experiments confirm the high effectiveness of developed approach. For some well-known tests the optimal results were achieved at the first time and at some other cases the results were improved.
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