汽车引擎盖持续温度下充填物特性演化对FCBGA可靠性的建模影响

P. Lall, Madhu L. Kasturi, Haotian Wu, J. Suhling, Edward Davis
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引用次数: 0

摘要

汽车引擎盖内部的工作条件涉及电子设备长时间暴露在150至200℃的温度范围内。当倒装芯片在非常高的温度下工作时,芯片和衬底之间的CTE(热膨胀系数)不匹配会导致组装翘曲。下填料用来支撑焊锡球,减少了焊点应变,提高了焊点的疲劳寿命。本文研究了两种下填料的非线性粘弹性演化对焊料球及其他有盖FCBGA(倒装芯片球栅阵列)封装元件塑性工作的影响。为了获得下填土的粘弹性特性,在DMA的扫频三点弯曲模式下,在0.1、0.21、0.46、1、2.15、4.64和10 Hz的7个离散频率下进行了TTS(时间-温度叠加)实验。位移因子是由WLF (Williams-Landel-Ferry)方程作为温度的函数来计算的。利用位移因子、TTS结果和选定的参考温度,得到了存储模量、损耗模量和tan-delta随频率变化的主曲线。根据存储模量和损耗模量主曲线,利用Schwarzl和Struik方程在时域内计算松弛模量,从而计算体积模量和剪切模量。在ANSYS中采用proony级数拟合体模量曲线和剪切模量曲线,并采用proony级数系数求解下填体特性。利用对称性,建立了四分之一盖FCBGA模型,在-40 ~ 125℃范围内进行了两个完整的热循环,得到了稳定的磁滞回线。老化样品包括原始样品和30、60、120天的样品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures
The operating conditions inside the automotive underhood involve the sustained exposure of electronics to temperatures in the range of 150 to 200 ℃ for prolonged periods of time. The CTE (coefficient of thermal expansion) mismatch between the chip and the substrate causes assembly-warpage when operating at very high temperatures in flip chip packages. The underfills are used to support the solder balls, which reduces the solder joint strains and improves the fatigue life of the joints. In this paper, the effect of evolution of non-linear viscoelastic properties of two underfills were studied on plastic-work in the solder balls and other lidded FCBGA (Flip Chip Ball Grid Array) package components. To obtain the viscoelastic behavior of underfills, TTS (time-temperature superposition) experiments are performed at 7 discrete frequencies 0.1, 0.21, 0.46, 1, 2.15, 4.64, and 10 Hz in frequency sweep three-point bend mode in DMA. The shift factors are calculated from WLF (Williams-Landel-Ferry) equation as a function of temperature. Using the shift factors, TTS results, and at selected reference temperatures, the Master curves are obtained for storage moduli, loss moduli and tan-delta as a function of frequency. The relaxation modulus, thus bulk and shear modulus, are calculated in time domain using Schwarzl and Struik equation from storage and loss modulus master curves. The bulk and shear modulus curves are fitted with Prony series in ANSYS and Prony series coefficients are implemented in underfill properties. By taking the advantage of symmetry, quarter lidded FCBGA model was built, and two complete thermal cycles were applied from -40℃ to 125℃ to get a steady hysteresis loop. Aging samples include the pristine samples and the sampled aged for 30, 60, and 120 days.
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