在芯片和板级自动故障诊断的实际应用

M. Maccanelli, A. Halliday, B. Bell, D. Steiss, K. Butler
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引用次数: 2

摘要

随着电子产品的尺寸越来越大,故障部件的诊断过程也变得越来越复杂。由于没有统一的系统来诊断产品设计的各个层面——集成电路(IC)、印刷电路板(PCB)和系统——的问题,这个问题变得更加复杂。本文介绍了自动化诊断过程技术的工业实验结果。作者开发了一种原型自动故障诊断(AFD)系统,该系统可以从两个不同的商用ATPG系统中输入故障字典以及测试模式应用的结果,并在给定电路中产生候选缺陷点列表。作者使用特殊的测试PCB,在商业浮点单元的一部分中模拟单个和多个卡在故障,并在PCB级运行原型。结果是令人鼓舞的,因为作者已经获得了相当准确的诊断,相对较低的覆盖率卡在故障集上,并且存在模拟的非经典缺陷。有可能在IC和PCB级别为AFD制定统一的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Practical application of automated fault diagnosis at the chip and board levels
As the sizes of electronic products grow larger, the process of diagnosing failed components becomes increasingly complex. The problem is compounded by the fact that there exists no unified system with which to diagnose problems at all levels of the product design-integrated circuit (IC), printed circuit board (PCB), and system. This paper presents the results of an industrial experiment with techniques for automating the diagnosis process. The authors have developed a prototype automated fault diagnosis (AFD) system which can input a fault dictionary from either of two different commercial ATPG systems along with results from test pattern application and produce a list of candidate defect sites within a given circuit. The authors ran the prototype against simulated single and multiple stuck-at faults in a portion of a commercial floating point unit and at the PCB level using a special test PCB. Results have been encouraging in that the authors have obtained fairly accurate diagnoses with relatively low coverage stuck-at fault sets and in the presence of simulated non-classical defects. It is possible to produce a uniform methodology for AFD at the IC and PCB levels.<>
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