用HIP键合法评价超导磁体结构的机械强度

K. Ueno
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引用次数: 0

摘要

MTC提出利用HIP扩散键合技术生产国际热核实验堆(ITER)环形磁场线圈支撑结构“径向板(RP)”。HIP可以降低材料和加工时间的生产成本。然而,HIP扩散连接截面的强度不足是一个问题。在本研究中,以HIP处理温度为参数,研究了结合强度和基材强度的变化。对HIP处理后的结合区截面进行了力学性能测试和微观组织观察,发现在1300[°C]时,结合强度相当于母材的机械强度。而基材经HIP处理后的室温屈服强度下降了24%。由于HIP的热输入导致晶粒变粗,因此在设计时需要考虑以保证规定的强度。在此基础上,利用HIP制作了RP节段的全尺寸模型。结果表明,模型粘结段的屈服强度和4 [K]断裂韧性均满足RP要求,质量均匀。通过本研究,证明了HIP扩散键可以应用于RP段的制备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Mechanical Strength Evaluation of Superconducting Magnet Structures by HIP Bonding Method
MTC proposed that production of the International Thermonuclear Experimental Reactor (ITER) toroidal magnetic field coils support structure "Radial Plate (RP)" using the HIP diffusion bonding. HIP allows production cost reductions in materials and machining time. However, insufficient strength of the HIP diffusion bonded sections was an issue. In this study, changes in bonding strength and base material strength were investigated using HIP treatment temperatures as parameters. Mechanical property tests and microstructure observation of the cross sections at the bonded areas after HIP treatment were conducted and as a result it was found that the bonding strength equivalent to the mechanical strength of the base metal can be obtained at 1300[°C]. However, the yield strength at room temperature of the base material after HIP treatment decreased by 24%. Since crystal grain coarsening occurs due to heat input by HIP, design considerations are required to guarantee the specified strength. Furthermore, a full-size mock-up of RP segments was fabricated by HIP. It was confirmed that the yield strength and fracture toughness at 4 [K] at the bonded sections of the mock-up satisfied the specified values required for the RP and uniform quality was obtained. From this study, it was proven that HIP diffusion bonding can be applied to the fabrication of RP segments.
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