在带渐变缓冲层的InP/InGaAs外延片上,波长截止为2.5 μm的2D SWIR图像传感器

P. Mushini, Wei Huang, M. Morales, R. Brubaker, Thuc-Uyen Nguyen, Matt Dobies, Wei Zhang, William J. Gustus, G. Mathews, S. Endicter, N. Paik
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引用次数: 9

摘要

在尺寸为320x256、间距为12.5μm的InP/InGaAs外延片上制备了截止波长为2.5μm的二维光电探测器阵列。采用新的生长和制造技术来制造这些阵列并优化其性能。在很宽的温度范围内研究了探测器的暗电流。制造的探测器阵列与ROIC配合,并与多级TEC封装,并在FPA级别进一步研究。研究了梯度缓冲层对传感器性能的影响,并将结果与其他在扩展波长材料上开发和制造二维图像传感器的方法进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
2D SWIR image sensor with extended wavelength cutoff of 2.5 μm on InP/InGaAs epitaxial wafers with graded buffer layers
Two-dimensional photo detector arrays with a cutoff wavelength of 2.5 μm were fabricated on InP/InGaAs epitaxial wafers with graded buffer layers in a 320x256 geometry on a 12.5μm pitch. Novel growth and fabrication techniques were employed to fabricate these arrays and optimize the performance. The dark current of the detector was investigated for a wide range of temperatures. The fabricated detector array was mated with a ROIC and packaged with a multi-stage TEC and investigated further at the FPA level. The effect of the graded buffer layers on the sensor performance was investigated and the results were compared to other methods used to develop and fabricate 2D image sensors on extended wavelength materials.
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