P. Mushini, Wei Huang, M. Morales, R. Brubaker, Thuc-Uyen Nguyen, Matt Dobies, Wei Zhang, William J. Gustus, G. Mathews, S. Endicter, N. Paik
{"title":"在带渐变缓冲层的InP/InGaAs外延片上,波长截止为2.5 μm的2D SWIR图像传感器","authors":"P. Mushini, Wei Huang, M. Morales, R. Brubaker, Thuc-Uyen Nguyen, Matt Dobies, Wei Zhang, William J. Gustus, G. Mathews, S. Endicter, N. Paik","doi":"10.1117/12.2225109","DOIUrl":null,"url":null,"abstract":"Two-dimensional photo detector arrays with a cutoff wavelength of 2.5 μm were fabricated on InP/InGaAs epitaxial wafers with graded buffer layers in a 320x256 geometry on a 12.5μm pitch. Novel growth and fabrication techniques were employed to fabricate these arrays and optimize the performance. The dark current of the detector was investigated for a wide range of temperatures. The fabricated detector array was mated with a ROIC and packaged with a multi-stage TEC and investigated further at the FPA level. The effect of the graded buffer layers on the sensor performance was investigated and the results were compared to other methods used to develop and fabricate 2D image sensors on extended wavelength materials.","PeriodicalId":222501,"journal":{"name":"SPIE Defense + Security","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"2D SWIR image sensor with extended wavelength cutoff of 2.5 μm on InP/InGaAs epitaxial wafers with graded buffer layers\",\"authors\":\"P. Mushini, Wei Huang, M. Morales, R. Brubaker, Thuc-Uyen Nguyen, Matt Dobies, Wei Zhang, William J. Gustus, G. Mathews, S. Endicter, N. Paik\",\"doi\":\"10.1117/12.2225109\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Two-dimensional photo detector arrays with a cutoff wavelength of 2.5 μm were fabricated on InP/InGaAs epitaxial wafers with graded buffer layers in a 320x256 geometry on a 12.5μm pitch. Novel growth and fabrication techniques were employed to fabricate these arrays and optimize the performance. The dark current of the detector was investigated for a wide range of temperatures. The fabricated detector array was mated with a ROIC and packaged with a multi-stage TEC and investigated further at the FPA level. The effect of the graded buffer layers on the sensor performance was investigated and the results were compared to other methods used to develop and fabricate 2D image sensors on extended wavelength materials.\",\"PeriodicalId\":222501,\"journal\":{\"name\":\"SPIE Defense + Security\",\"volume\":\"38 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE Defense + Security\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2225109\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE Defense + Security","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2225109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
2D SWIR image sensor with extended wavelength cutoff of 2.5 μm on InP/InGaAs epitaxial wafers with graded buffer layers
Two-dimensional photo detector arrays with a cutoff wavelength of 2.5 μm were fabricated on InP/InGaAs epitaxial wafers with graded buffer layers in a 320x256 geometry on a 12.5μm pitch. Novel growth and fabrication techniques were employed to fabricate these arrays and optimize the performance. The dark current of the detector was investigated for a wide range of temperatures. The fabricated detector array was mated with a ROIC and packaged with a multi-stage TEC and investigated further at the FPA level. The effect of the graded buffer layers on the sensor performance was investigated and the results were compared to other methods used to develop and fabricate 2D image sensors on extended wavelength materials.