基于硅上聚合物波导和多个量子阱调制器集成的芯片级光互连的演示

IEEE Photonic Society 24th Annual Meeting Pub Date : 2011-12-22 DOI:10.1109/PHO.2011.6110461

R. Nair, T. Gu, K. Goossen, F. Kiamilev, M. Haney

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引用次数: 8

摘要

演示了用于实现高密度芯片级光互连的多材料混合集成概念的关键要素。具有曲面面的聚合物波导用于耦合光进出与硅结合的MQW器件倒装芯片。

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Demonstration of chip-scale optical interconnects based on the integration of polymer waveguides and multiple quantum well modulators on silicon

Key elements of a multi-material hybrid integration concept for implementing high-density chip-scale optical interconnects are demonstrated. Polymer waveguides with curved facets are used to couple light in and out of the MQW devices flip-chip bonded to silicon.

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IEEE Photonic Society 24th Annual Meeting

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