{"title":"用于射频CMOS器件精确片上表征的接地屏蔽测量技术","authors":"T. Kolding, O. Jensen, T. Larsen","doi":"10.1109/ICMTS.2000.844439","DOIUrl":null,"url":null,"abstract":"This paper presents a new test fixture with associated de-embedding procedure for efficient and accurate on-wafer device measurements at microwave frequencies. The fixture is based on a substrate shield and (i) provides an accurate common ground for N-port measurements, (ii) effectively reduces substrate carried coupling, (iii) gives well-defined parasitics for simplified de-embedding, and (iv) fits arbitrarily large devices. Due to these characteristics, the accompanying de-embedding technique requires only few in-fixture standards that can be fabricated with very high accuracy; even in standard CMOS processes. The technique can advantageously be applied to a wide range of commonly used processes, but highest performance improvement is achieved with low-resistivity substrates. The performance of the technique is demonstrated to 12 GHz in a 0.25 /spl mu/m CMOS technology and conclusions are drawn.","PeriodicalId":447680,"journal":{"name":"ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"46","resultStr":"{\"title\":\"Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices\",\"authors\":\"T. Kolding, O. Jensen, T. Larsen\",\"doi\":\"10.1109/ICMTS.2000.844439\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a new test fixture with associated de-embedding procedure for efficient and accurate on-wafer device measurements at microwave frequencies. The fixture is based on a substrate shield and (i) provides an accurate common ground for N-port measurements, (ii) effectively reduces substrate carried coupling, (iii) gives well-defined parasitics for simplified de-embedding, and (iv) fits arbitrarily large devices. Due to these characteristics, the accompanying de-embedding technique requires only few in-fixture standards that can be fabricated with very high accuracy; even in standard CMOS processes. The technique can advantageously be applied to a wide range of commonly used processes, but highest performance improvement is achieved with low-resistivity substrates. The performance of the technique is demonstrated to 12 GHz in a 0.25 /spl mu/m CMOS technology and conclusions are drawn.\",\"PeriodicalId\":447680,\"journal\":{\"name\":\"ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095)\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-03-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"46\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.2000.844439\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 2000. Proceedings of the 2000 International Conference on Microelectronic Test Structures (Cat. No.00CH37095)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.2000.844439","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 46
摘要
本文提出了一种新的测试夹具及其相关的去嵌入程序,用于在微波频率下高效准确地测量片上器件。该夹具基于基板屏蔽,并且(i)为n端口测量提供了准确的公共接地,(ii)有效地减少了基板携带的耦合,(iii)为简化的去嵌入提供了明确的寄生,(iv)适合任意大的设备。由于这些特点,伴随的去嵌入技术只需要很少的夹具内标准,可以以非常高的精度制造;即使在标准的CMOS工艺中。该技术可以有利地应用于广泛的常用工艺,但最大的性能改进是在低电阻率衬底上实现的。在0.25 /spl μ m CMOS技术下,对该技术在12 GHz下的性能进行了验证,并得出了结论。
Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices
This paper presents a new test fixture with associated de-embedding procedure for efficient and accurate on-wafer device measurements at microwave frequencies. The fixture is based on a substrate shield and (i) provides an accurate common ground for N-port measurements, (ii) effectively reduces substrate carried coupling, (iii) gives well-defined parasitics for simplified de-embedding, and (iv) fits arbitrarily large devices. Due to these characteristics, the accompanying de-embedding technique requires only few in-fixture standards that can be fabricated with very high accuracy; even in standard CMOS processes. The technique can advantageously be applied to a wide range of commonly used processes, but highest performance improvement is achieved with low-resistivity substrates. The performance of the technique is demonstrated to 12 GHz in a 0.25 /spl mu/m CMOS technology and conclusions are drawn.