用于射频CMOS器件精确片上表征的接地屏蔽测量技术

T. Kolding, O. Jensen, T. Larsen
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引用次数: 46

摘要

本文提出了一种新的测试夹具及其相关的去嵌入程序,用于在微波频率下高效准确地测量片上器件。该夹具基于基板屏蔽,并且(i)为n端口测量提供了准确的公共接地,(ii)有效地减少了基板携带的耦合,(iii)为简化的去嵌入提供了明确的寄生,(iv)适合任意大的设备。由于这些特点,伴随的去嵌入技术只需要很少的夹具内标准,可以以非常高的精度制造;即使在标准的CMOS工艺中。该技术可以有利地应用于广泛的常用工艺,但最大的性能改进是在低电阻率衬底上实现的。在0.25 /spl μ m CMOS技术下,对该技术在12 GHz下的性能进行了验证,并得出了结论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Ground-shielded measuring technique for accurate on-wafer characterization of RF CMOS devices
This paper presents a new test fixture with associated de-embedding procedure for efficient and accurate on-wafer device measurements at microwave frequencies. The fixture is based on a substrate shield and (i) provides an accurate common ground for N-port measurements, (ii) effectively reduces substrate carried coupling, (iii) gives well-defined parasitics for simplified de-embedding, and (iv) fits arbitrarily large devices. Due to these characteristics, the accompanying de-embedding technique requires only few in-fixture standards that can be fabricated with very high accuracy; even in standard CMOS processes. The technique can advantageously be applied to a wide range of commonly used processes, but highest performance improvement is achieved with low-resistivity substrates. The performance of the technique is demonstrated to 12 GHz in a 0.25 /spl mu/m CMOS technology and conclusions are drawn.
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