K. Hara, Tomoko Kakegawa, S. Wada, Tomoyuki Utsumi, T. Oda
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引用次数: 14
摘要
我们提出了采用阶梯场板的薄层SOI器件的概念,以获得低导通电阻的LDMOSFET。由于可以忽略垂直路径上的电离积分,薄层SOI器件可以获得高击穿电压。通过减小表面氧化物的厚度,可以增加薄层SOI器件漂移区的掺杂浓度。这是因为随着氧化物厚度的减小,诱导电荷的数量增加了。600 V LDMOSFET的制造符合所提出的概念,它完成了迄今为止报道的LDMOSFET的最佳权衡(击穿电压为645 V,比导通电阻为4.5 Ω·mm2)。
Low on-resistance high voltage thin layer SOI LDMOS transistors with stepped field plates
We have proposed the concept of thin layer SOI devices with stepped field plates to obtain a low on-resistance LDMOSFET. Thin layer SOI devices can acquire a high breakdown voltage because the ionization integral over the vertical path may be neglected. A doping concentration in a drift region of a thin layer SOI device can be increased by reducing the thickness of the surface oxide. This is because the amount of induced charge increases by reducing the thickness of the oxide. The 600-V LDMOSFET was fabricated in line with the proposed concept and it accomplished the best trade-off among the LDMOSFETs reported so far (the breakdown voltage of 645 V and the specific on-resistance of 4.5 Ω·mm2).