液固扩散键合:一种新型的连接技术

A. Larsson, T. A. Tollefsen, K. Aasmundtveit, O. M. L⊘vvik
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引用次数: 1

摘要

液固扩散键合是一种由简单二元体系形成固液两相场连接的新型连接技术。LSD产生的接头适用于高于初始粘合材料的熔化温度的温度。液固相互扩散改变了接头的成分和组织。最终接头的特点是不一致重熔,形成连贯的连续多孔固溶相,并形成液化孔隙。本文简要介绍了该方法,并给出了基于Au-Ge系统的实验结果。高质量的关节被创造出来。有效熔点比体系的初始共晶熔点提高了200℃以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Liquid Solid Diffusion (LSD) bonding: A novel joining technology
Liquid Solid Diffusion (LSD) bonding is a novel joining technology forming solid and liquid two-phase field joints from simple binary systems. LSD creates joints that are applicable at temperatures above the melting temperature of the material composition of the initial bond. Liquid and solid inter-diffusion transform the joint composition and microstructure. The final joint is characterized by incongruent re-melting forming a coherent continuous porous solid solution phase with liquefied pores. This article briefly describes the methodology and presents experimental results based on the Au-Ge system. High quality joints were created. The effective melting point was increased by more than 200 °C above the initial eutectic melting point of the system.
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