超高压LDMOS器件的性能与可靠性协同设计

H. B. Variar, Jhnanesh Somayaji, M. Shrivastava
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引用次数: 0

摘要

本文介绍了特高压(UHV)横向扩散金属氧化物半导体(LDMOS)器件的性能和可靠性(HCI, SOA和ESD)协同设计见解。使用3D TCAD系统地开发了四种不同类型的特高压LDMOS器件(Conventional、RESURF、SOI和RESURF SOI)的器件设计见解和性能优化指南。本文首次研究了分步设计栅极、漏极和源场极板的方法及其对这四种不同特高压设计协同设计的影响,结果表明,在不改变导通电阻的情况下,器件击穿性能得到了显著改善。最后,对所有四种特高压LDMOS架构(即常规、RESURF、SOI和RESURF SOI)的最佳设计进行了性能和HCI、ESD和SOA可靠性基准测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Performance and Reliability Co-design of Ultra High Voltage LDMOS Devices
This work presents the performance and re-liability (HCI, SOA and ESD) co-design insights of Ul-tra High Voltage (UHV) Laterally Diffused Metal Oxide Semiconductor (LDMOS) devices. Device design insights and performance optimization guidelines for four different types of UHV LDMOS devices (Conventional, RESURF, SOI and RESURF SOI) is systematically developed using 3D TCAD. For the first time, a step-by-step approach to design gate, drain and source field plates and its implications on the co-design of these four different UHV designs is investigated, which demonstrated significant improvement in the device breakdown without altering its ON-resistance. Finally, performance and HCI, ESD & SOA reliability benchmarking is done for the optimum designs of all four (i.e. Conventional, RESURF, SOI and RESURF SOI) UHV LDMOS architectures.
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