B. Tillack, R. Banisch, H. Richter, K. Hoeppner, O. Joachim, J. Knopke, U. Retzlaf
{"title":"用SiO/sub / 2/上多晶硅的ZMR法制备的高压用完全介质隔离硅","authors":"B. Tillack, R. Banisch, H. Richter, K. Hoeppner, O. Joachim, J. Knopke, U. Retzlaf","doi":"10.1109/SOSSOI.1990.145740","DOIUrl":null,"url":null,"abstract":"The aim is to demonstrate that it is possible to create completely dielectrically isolated Si using the zone-melted recrystallization (ZMR) technique and that the material quality allows application to high-voltage devices. In the first case the seeding windows were etched into the thermal oxide in the area between the tub-shaped grooves. Polycrystalline silicon films of different thicknesses (up to 80 mu m) were deposited. In the second case a thin polycrystalline silicon film (1 mu m) acts as a connection between the single-crystalline substrate and poly-Si in the grooves. The seeding recrystallization results in single-crystalline silicon","PeriodicalId":344373,"journal":{"name":"1990 IEEE SOS/SOI Technology Conference. Proceedings","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Completely dielectrically isolated silicon for high voltage application produced by ZMR of poly Si on SiO/sub 2/\",\"authors\":\"B. Tillack, R. Banisch, H. Richter, K. Hoeppner, O. Joachim, J. Knopke, U. Retzlaf\",\"doi\":\"10.1109/SOSSOI.1990.145740\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The aim is to demonstrate that it is possible to create completely dielectrically isolated Si using the zone-melted recrystallization (ZMR) technique and that the material quality allows application to high-voltage devices. In the first case the seeding windows were etched into the thermal oxide in the area between the tub-shaped grooves. Polycrystalline silicon films of different thicknesses (up to 80 mu m) were deposited. In the second case a thin polycrystalline silicon film (1 mu m) acts as a connection between the single-crystalline substrate and poly-Si in the grooves. The seeding recrystallization results in single-crystalline silicon\",\"PeriodicalId\":344373,\"journal\":{\"name\":\"1990 IEEE SOS/SOI Technology Conference. Proceedings\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1990 IEEE SOS/SOI Technology Conference. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOSSOI.1990.145740\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1990 IEEE SOS/SOI Technology Conference. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOSSOI.1990.145740","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Completely dielectrically isolated silicon for high voltage application produced by ZMR of poly Si on SiO/sub 2/
The aim is to demonstrate that it is possible to create completely dielectrically isolated Si using the zone-melted recrystallization (ZMR) technique and that the material quality allows application to high-voltage devices. In the first case the seeding windows were etched into the thermal oxide in the area between the tub-shaped grooves. Polycrystalline silicon films of different thicknesses (up to 80 mu m) were deposited. In the second case a thin polycrystalline silicon film (1 mu m) acts as a connection between the single-crystalline substrate and poly-Si in the grooves. The seeding recrystallization results in single-crystalline silicon