3D-SWIFT: a high-performance 3D-stacked wide IO DRAM

Wide IO has been standardized as a low-power, high-bandwidth DRAM for embedded system. The performance of Wide IO, however, is limited by the power constraint and unexploited fine-grained memory parallelism. In this work, we propose a novel architecture, 3D-SWIFT, that achieves high access parallelism by partitioning a memory bank into sub-banks with a fine access granularity, which takes advantage of 3D die-stacking. The power constraint is naturally eliminated by the fine-grained structure due to the reduced activation power. Moreover, we propose sub-bank autonomy and introduce corresponding management policies to enable an intelligent interface protocol. Thanks to sub-rank autonomy, the overhead of tracking huge concurrent accesses in the memory controller is significantly reduced, making our 3D-SWIFT architecture scalable for future memory systems. We evaluate our 3D-SWIFT and the results show that 3D-SWIFT can achieve 87.6% performance improvement compared to the state-of-the-art Wide IO.