金刚石半导体器件,最先进的材料生长和器件加工

H. Umezawa
{"title":"金刚石半导体器件,最先进的材料生长和器件加工","authors":"H. Umezawa","doi":"10.1109/IEDM13553.2020.9371947","DOIUrl":null,"url":null,"abstract":"Diamond is known as an ultimate semiconductor material because of its superior properties and it is expected to be employed in next-generation power electronic devices. Progress in wafer technology and device processing techniques have improved the performance of semiconductor devices. In this paper, state of the art of diamond semiconductor devices, especially power devices and harsh environmental devices including wafer technologies will be introduced.","PeriodicalId":415186,"journal":{"name":"2020 IEEE International Electron Devices Meeting (IEDM)","volume":"61 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Diamond Semiconductor Devices, state-of-the-art of material growth and device processing\",\"authors\":\"H. Umezawa\",\"doi\":\"10.1109/IEDM13553.2020.9371947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Diamond is known as an ultimate semiconductor material because of its superior properties and it is expected to be employed in next-generation power electronic devices. Progress in wafer technology and device processing techniques have improved the performance of semiconductor devices. In this paper, state of the art of diamond semiconductor devices, especially power devices and harsh environmental devices including wafer technologies will be introduced.\",\"PeriodicalId\":415186,\"journal\":{\"name\":\"2020 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"61 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM13553.2020.9371947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM13553.2020.9371947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

金刚石因其优越的性能被称为“终极半导体材料”,有望用于下一代电力电子器件。晶圆技术和器件加工技术的进步提高了半导体器件的性能。本文将介绍金刚石半导体器件的最新进展,特别是功率器件和恶劣环境器件,包括晶圆技术。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Diamond Semiconductor Devices, state-of-the-art of material growth and device processing
Diamond is known as an ultimate semiconductor material because of its superior properties and it is expected to be employed in next-generation power electronic devices. Progress in wafer technology and device processing techniques have improved the performance of semiconductor devices. In this paper, state of the art of diamond semiconductor devices, especially power devices and harsh environmental devices including wafer technologies will be introduced.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信