基于毛细管自组装的多芯片到晶圆系统集成技术

2018 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS) Pub Date : 2018-07-01 DOI:10.1109/MARSS.2018.8481147

T. Fukushima

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引用次数: 0

摘要

我们从2005年开始提出并开发了基于液体表面张力的自组装三维集成技术。本文介绍了面朝上和/或面朝下配置的微凹凸键合和无凹凸键合，用于形成细间距互连。此外，还解释了“非转移堆叠”，即倒装自组装和“转移堆叠”，即使用SAE(自组装和静电)载体进行晶片到晶片的重构。

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Capillary Self-Assembly Based Multichip-to-Wafer System Integration Technologies

We have proposed and developed 3D integration technologies based on self-assembly using surface tension of liquid from 2005. In this paper, microbump bonding and bumpless bonding in face-up and/or face-down configurations are introduced for fine-pitch interconnect formation. In addition, “non-transfer stacking”, in other word, flip-chip self-assembly and “transfer stacking” called reconfigure-wafer-to-wafer using SAE (Self-Assembly and Electrostatic) carrier are explained.

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2018 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS)

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