电子产品波峰焊中使用的铅和无铅焊料的生命周期影响

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI:10.1109/ISEE.2005.1437001

M. L. Socolof, J. Geibig

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引用次数: 4

摘要

美国环境保护署和美国电子工业资助的铅和两种无铅替代焊料的生命周期评估的结果。对波峰焊应用的16个不同环境类别的影响评分进行了报告。评估的棒材焊料包括锡铅、锡银铜和锡铜。在四个类别中，锡铅焊料比无铅焊料具有更高的影响得分，而在五个类别中具有更低的影响。使用/应用阶段是大多数影响类别的主要贡献者，而上游和生命周期结束过程也对特定影响类别做出了重大贡献，具体取决于焊料。本文还对产银量和垃圾渗滤液数据的影响进行了敏感性分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Life-cycle impacts of lead and lead-free solder used in wave soldering of electronics

Results from a joint US EPA and US electronics industry-funded life-cycle assessment of lead and two lead-free alternative solders are presented. Impact scores are reported in 16 different environmental categories for wave soldering applications. Bar solders evaluated include tin-lead, tin-silver-copper, and tin-copper. Tin-lead solder was determined to have higher impact scores than the lead-free solders in four categories, while having lower impacts in five. The use/application stage was the dominant contributor to most impact categories, while upstream and end-of-life processes also made significant contributions to specific impact categories, depending on the solder. Sensitivity analyses of the effect of silver production as well as landfill leachate data are also presented.

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Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.

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