柔性低成本基板上的RFID和RFID传感器的设计与开发

A. Rida, M. Tentzeris
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引用次数: 9

摘要

本书介绍了射频识别(RFID)和RFID传感器的设计和开发的一步一步的讨论柔性低成本基板UHF频段。各种全功能构建模块的例子(天线的设计和制造,集成集成电路和微控制器,电源,以及喷墨打印技术)证明了这种方法在低成本RFID和支持RFID的传感器领域的革命性影响。这种方法可以很容易地扩展到其他微波和无线应用。第一章描述了RFID和传感器技术的基本功能、物理和it相关原理。第二章详细解释了喷墨打印技术,提供了由纳米银颗粒组成的导电油墨的特性,同时强调了该技术作为一种快速简单的制造技术的重要性,特别是在柔性有机基材上,如液晶聚合物(LCP)或纸基基材。第三章演示了几个紧凑的喷墨打印UHF RFID天线,使用天线匹配技术来匹配IC的复杂阻抗作为原型,以提供该技术的概念证明。第四章讨论了在小型化高频电路中使用共形磁性材料作为衬底的好处。此外,在第五章中,作者还对有机基板上完全集成无线传感器模块的最新领域进行了补充,并展示了有史以来第一个与纸上RFID标签模块集成的2D传感器,以及3D多层纸基射频/微波结构的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design and Development of RFID and RFID-Enabled Sensors on Flexible Low Cost Substrates
This book presents a step-by-step discussion of the design and development of radio frequency identification (RFID) and RFID-enabled sensors on flexible low cost substrates for UHF frequency bands. Various examples of fully function building blocks (design and fabrication of antennas, integration with ICs and microcontrollers, power sources, as well as inkjet-printing techniques) demonstrate the revolutionary effect of this approach in low cost RFID and RFID-enabled sensors fields. This approach could be easily extended to other microwave and wireless applications as well. The first chapter describes the basic functionality and the physical and IT-related principles underlying RFID and sensors technology. Chapter two explains in detail inkjet-printing technology providing the characterization of the conductive ink, which consists of nano-silver-particles, while highlighting the importance of this technology as a fast and simple fabrication technique especially on flexible organic substrates such as Liquid Crystal Polymer (LCP) or paper-based substrates. Chapter three demonstrates several compact inkjet-printed UHF RFID antennas using antenna matching techniques to match IC's complex impedance as prototypes to provide the proof of concept of this technology. Chapter four discusses the benefits of using conformal magnetic material as a substrate for miniaturized high-frequency circuit applications. In addition, in Chapter five, the authors also touch up the state-of-the-art area of fully-integrated wireless sensor modules on organic substrates and show the first ever 2D sensor integration with an RFID tag module on paper, as well as the possibility of 3D multilayer paper-based RF/microwave structures.
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